24 search results - page 5 / 5 » An area-optimality study of floorplanning |
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
MJ
2011
13 years 8 days ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
ISPD
1997
ACM
13 years 9 months ago
1997
ACM
Advances in fabrication technology have resulted in a continual shrinkage of device dimensions. This has resulted in smaller device delays, greater resistance along interconnect w...
BMCBI
2008
13 years 5 months ago
2008
Background: Microarray experiments generate vast amounts of data. The functional context of differentially expressed genes can be assessed by querying the Gene Ontology (GO) datab...