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2011

Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling

8 years 1 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute multiple applications (games, video), while meeting additional design constraints (energy consumption, time-to-market, etc.). Moreover, the rise of temperature in the die for MPSoCs, especially for forthcoming 3D chips, can seriously affect their final performance and reliability. In this context, transient thermal modeling is a key challenge to study the accelerated thermal problems of MPSoC designs, as well as to validate the benefits of active cooling techniques (e.g., liquid cooling), combined with other state-of-the-art methods (e.g., dynamic frequency and voltage scaling), as a solution to overcome run-time thermal runaway. In this paper, I present a novel approach for fast transient thermal modeling and analysis of 2D/3D MPSoCs with active cooling, which relies on the exploitation of combined hardware...
Pablo Garcia Del Valle, David Atienza
Added 14 May 2011
Updated 14 May 2011
Type Journal
Year 2011
Where MJ
Authors Pablo Garcia Del Valle, David Atienza
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