115 search results - page 1 / 23 » Analysis for Signal and Power Integrity Using the Multilayer... |
ISCAS
2007
IEEE
13 years 11 months ago
2007
IEEE
— We present a method for fast analysis of signal and power integrity based on a recently developed multilayered finite difference method (M-FDM). In order to accurately model m...
DAC
2007
ACM
14 years 5 months ago
2007
ACM
Power integrity simulation for system-on-package (SoP) based modules is a crucial bottleneck in the SoP design flow. In this paper, the multi-layer finite difference method (M-FDM...
DAC
2008
ACM
14 years 5 months ago
2008
ACM
In the design of complex power distribution networks (PDN) with multiple power islands, it is required that the PDN represents a low impedance as seen by the digital modules. This...
ISQED
2007
IEEE
13 years 11 months ago
2007
IEEE
Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
MR
2002
13 years 4 months ago
2002
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analy...