4 search results - page 1 / 1 » Analysis of 3D conjugate heat transfers in electronics |
DATE
1997
IEEE
13 years 9 months ago
1997
IEEE
An efficient method for the analysis of real 3D conjugate heat transfer for electronic devices is presented. This methodology is based on the coupling of two software : a conducti...
CORR
2008
Springer
13 years 4 months ago
2008
Springer
The reported research work presents numerical studies validated by experimental results of a flat micro heat pipe with sintered copper wick structure. The objectives of this resea...
DAC
2000
ACM
14 years 5 months ago
2000
ACM
Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. Semiconductor Industry Association (SIA) roadmap predicts that, beyond the ...
JCC
2008
13 years 4 months ago
2008
: A new program called pyVib has been developed as a tool for the analysis of Gaussian (Gaussian 03, Gaussian Inc., Pittsburgh, PA) outputs of vibrational absorption (IR), Raman as...