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» Are carbon nanotubes the future of VLSI interconnections
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DATE
2007
IEEE
150views Hardware» more  DATE 2007»
13 years 11 months ago
Assessing carbon nanotube bundle interconnect for future FPGA architectures
Field Programmable Gate Arrays (FPGAs) are important hardware platforms in various applications due to increasing design complexity and mask costs. However, as CMOS process techno...
Soumya Eachempati, Arthur Nieuwoudt, Aman Gayasen,...
DATE
2009
IEEE
140views Hardware» more  DATE 2009»
13 years 11 months ago
Imperfection-immune VLSI logic circuits using Carbon Nanotube Field Effect Transistors
Carbon Nanotube Field-Effect Transistors (CNFETs) show big promise as extensions to silicon-CMOS because: 1) Ideal CNFETs can provide significant energy and performance benefits o...
Subhasish Mitra, Jie Zhang, Nishant Patil, Hai Wei
VLSID
2009
IEEE
144views VLSI» more  VLSID 2009»
14 years 5 months ago
Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
Sudeep Pasricha, Nikil Dutt, Fadi J. Kurdahi
DAC
2006
ACM
13 years 10 months ago
A high density, carbon nanotube capacitor for decoupling applications
We present a novel application for carbon nanotube devices, implementing a high density 3-D capacitor, which can be useful for decoupling applications to reduce supply voltage var...
Mark M. Budnik, Arijit Raychowdhury, Aditya Bansal...