44 search results - page 2 / 9 » CAD challenges for 3D ICs |
ASPDAC
2012
ACM
12 years 22 days ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
ICCD
2007
IEEE
14 years 1 months ago
2007
IEEE
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...
BMVC
2010
13 years 3 months ago
2010
Recognizing 3D objects from arbitrary view points is one of the most fundamental problems in computer vision. A major challenge lies in the transition between the 3D geometry of o...
DAC
2009
ACM
14 years 6 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
ICCAD
2004
IEEE
14 years 1 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...