56 search results - page 11 / 12 » Chip and PIN is Broken |
ICCAD
2007
IEEE
14 years 1 months ago
2007
IEEE
— Energy efficiency has become one of the most important issues to be addressed in today’s System-on-a-Chip (SoC) designs. One way to lower the power consumption is to reduce ...
ISPASS
2009
IEEE
13 years 11 months ago
2009
IEEE
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
ICCAD
2008
IEEE
13 years 11 months ago
2008
IEEE
— The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O’s in VLSI designs; it can achieve smaller package size, shorter wirelength, an...
ISCA
2008
IEEE
13 years 11 months ago
2008
IEEE
We expect that many-core microprocessors will push performance per chip from the 10 gigaflop to the 10 teraflop range in the coming decade. To support this increased performance...
MICRO
2006
IEEE
13 years 10 months ago
2006
IEEE
Dynamic software bug detection tools are commonly used because they leverage run-time information. However, they suffer from a fundamental limitation, the Path Coverage Problem: t...