3 search results - page 1 / 1 » Cohesive zone modeling for structural integrity analysis of ... |
MR
2007
13 years 4 months ago
2007
Due to the miniaturization of integrated circuits, their thermo-mechanical reliability tends to become a truly critical design criterion.
3DIC
2009
IEEE
13 years 11 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
IOLTS
2003
IEEE
13 years 10 months ago
2003
IEEE
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...