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ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 3 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
TVCG
2011
136views more  TVCG 2011»
13 years 8 days ago
Interactive Mesh Cutting Using Constrained Random Walks
—This paper considers the problem of interactively finding the cutting contour to extract components from an existing mesh. First, we propose a constrained random walks algorith...
Juyong Zhang, Jianmin Zheng, Jianfei Cai
TITB
2010
163views Education» more  TITB 2010»
13 years 3 days ago
Absolute electrical impedance tomography (aEIT) guided ventilation therapy in critical care patients: simulations and future tre
Thoracic electrical impedance tomography (EIT) is a noninvasive, radiation-free monitoring technique whose aim is to reconstruct a cross-sectional image of the internal spatial dis...
Mouloud Azzedine Denaï, Mahdi Mahfouf, Suzani...
APVIS
2011
12 years 5 months ago
Edge maps: Representing flow with bounded error
Robust analysis of vector fields has been established as an important tool for deriving insights from the complex systems these fields model. Many analysis techniques rely on co...
Harsh Bhatia, Shreeraj Jadhav, Peer-Timo Bremer, G...