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ICCAD
2001
IEEE
113views Hardware» more  ICCAD 2001»
14 years 1 months ago
Compact Modeling and SPICE-Based Simulation for Electrothermal Analysis of Multilevel ULSI Interconnects
This paper presents both compact analytical models and fast SPICE based 3-D electro-thermal simulation methodology to characterize thermal effects due to Joule heating in high per...
TingYen Chiang, Kaustav Banerjee, Krishna Saraswat
DAC
2002
ACM
14 years 5 months ago
A physical model for the transient response of capacitively loaded distributed rlc interconnects
Rapid approximation of the transient response of high-speed global interconnects is needed to estimate the time delay, crosstalk, and overshoot in a GSI multilevel wiring network....
Raguraman Venkatesan, Jeffrey A. Davis, James D. M...