7 search results - page 2 / 2 » Control-Theoretic Techniques and Thermal-RC Modeling for Acc... |
ISCA
2003
IEEE
13 years 10 months ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
ISPD
2010
ACM
14 years 8 days ago
2010
ACM
Thermal/power issues have become increasingly important with more and more transistors being put on a single chip. Many dynamic thermal/power management techniques have been propo...