137 search results - page 27 / 28 » Design Challenges for New Application-Specific Processors |
MJ
2011
13 years 7 days ago
2011
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
VEE
2009
ACM
14 years 2 days ago
2009
ACM
Today’s web applications are pushing the limits of modern web browsers. The emergence of the browser as the platform of choice for rich client-side applications has shifted the ...
VEE
2009
ACM
14 years 2 days ago
2009
ACM
r of high-level languages lies in their abstraction over hardware and software complexity, leading to greater security, better reliability, and lower development costs. However, o...
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
PLDI
2004
ACM
13 years 10 months ago
2004
ACM
When vectorizing for SIMD architectures that are commonly employed by today’s multimedia extensions, one of the new challenges that arise is the handling of memory alignment. Pr...