38 search results - page 7 / 8 » Design and Management of 3D Chip Multiprocessors Using Netwo... |
MICRO
2009
IEEE
14 years 12 days ago
2009
IEEE
3D-integration is a promising technology to help combat the “Memory Wall” in future multi-core processors. Past work has considered using 3D-stacked DRAM as a large last-level...
ASPLOS
2004
ACM
13 years 11 months ago
2004
ACM
Power density in high-performance processors continues to increase with technology generations as scaling of current, clock speed, and device density outpaces the downscaling of s...
ISCA
2007
IEEE
14 years 2 days ago
2007
IEEE
Virtual Private Machines (VPM) provide a framework for Quality of Service (QoS) in CMP-based computer systems. VPMs incorporate microarchitecture mechanisms that allow shares of h...
ICDE
2006
IEEE
14 years 7 months ago
2006
IEEE
The rapid increase in the data volumes for the past few decades has intensified the need for high processing power for database and data mining applications. Researchers have acti...
PPOPP
2010
ACM
14 years 3 months ago
2010
ACM
Most modern Chip Multiprocessors (CMP) feature shared cache on chip. For multithreaded applications, the sharing reduces communication latency among co-running threads, but also r...