33 search results - page 7 / 7 » Design for manufacturability and reliability for TSV-based 3... |
DATE
2010
IEEE
13 years 10 months ago
2010
IEEE
—Variations of process parameters have an important impact on reliability and yield in deep sub micron IC technologies. One methodology to estimate the influence of these effects...
TCAD
2008
13 years 5 months ago
2008
Given a set of pins and a set of obstacles on a plane, an obstacle-avoiding rectilinear Steiner minimal tree (OARSMT) connects these pins, possibly through some additional points (...
TVLSI
2002
13 years 5 months ago
2002
Abstract--This paper provides a high level survey of the increasing effects of on-chip inductance. These effects are classified into desirable and nondesirable effects. Among the u...