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DAC
2009
ACM
14 years 6 months ago
Dynamic thermal management via architectural adaptation
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
Ramkumar Jayaseelan, Tulika Mitra
ICS
2009
Tsinghua U.
13 years 10 months ago
A comprehensive power-performance model for NoCs with multi-flit channel buffers
Large Multi-Processor Systems-on-Chip use Networks-on-Chip with a high degree of reusability and scalability for message communication. Therefore, network infrastructure is a cruc...
Mohammad Arjomand, Hamid Sarbazi-Azad