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DAC
2011
ACM
12 years 5 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
GIS
2008
ACM
13 years 7 months ago
Combining 3-D geovisualization with force feedback driven user interaction
We describe a prototype software system for investigating novel human-computer interaction techniques for 3-D geospatial data. This system, M4-Geo (Multi-Modal Mesh Manipulation o...
Adam Faeth, Michael Oren, Chris Harding
JCDL
2005
ACM
111views Education» more  JCDL 2005»
13 years 11 months ago
Digitization and 3D modeling of movable books
Movable books provide interesting challenges for digitization and user interfaces design. We report in this paper some preliminary results in the building of a 3D visualization wo...
Pierre Cubaud, Jérôme Dupire, Alexand...
SMA
2005
ACM
239views Solid Modeling» more  SMA 2005»
13 years 11 months ago
Bender: a virtual ribbon for deforming 3D shapes in biomedical and styling applications
In contrast to machined mechanical parts, the 3D shapes encountered in biomedical or styling applications contain many tubular parts, protrusions, engravings, embossings, folds, a...
Ignacio Llamas, Alexander Powell, Jarek Rossignac,...
NPAR
2010
ACM
13 years 11 months ago
Detail-preserving paint modeling for 3D brushes
Recent years have witnessed significant advances in 3D brush modeling and simulation in digital paint tools. Compared with traditional 2D brushes, a 3D brush can be both more intu...
Nelson Siu-Hang Chu, William Baxter, Li-Yi Wei, Na...