26 search results - page 1 / 6 » Distributing the Frontend for Temperature Reduction |
HPCA
2005
IEEE
14 years 5 months ago
2005
IEEE
Due to increasing power densities, both on-chip average and peak temperatures are fast becoming a serious bottleneck in processor design. This is due to the cost of removing the h...
ACSC
2006
IEEE
13 years 11 months ago
2006
IEEE
This paper describes a novel noise-robust automatic speech recognition (ASR) front-end that employs a combination of Mel-filterbank output compensation and cumulative distribution...
ISLPED
2005
ACM
13 years 11 months ago
2005
ACM
Temperature is becoming a first rate design criterion in ASICs due to its negative impact on leakage power, reliability, performance, and packaging cost. Incorporating awareness o...
DATE
2008
IEEE
13 years 12 months ago
2008
IEEE
The prospective use of upcoming nanometer CMOS technology nodes (65nm, 45nm, and beyond) in bioelectronic interfaces is raising a number of important issues concerning circuit arc...
DSN
2009
IEEE
2009
IEEE
Processor reliability enhancement through compiler-directed register file peak temperature reduction
13 years 9 months ago
Each semiconductor technology generation brings us closer to the imminent processor architecture heat wall, with all its associated adverse effects on system performance and reliab...