303 search results - page 2 / 61 » Dynamic thermal management via architectural adaptation |
DAC
2008
ACM
14 years 5 months ago
2008
ACM
Recently, processor power density has been increasing at an alarming rate resulting in high on-chip temperature. Higher temperature increases current leakage and causes poor relia...
HPCA
2008
IEEE
14 years 5 months ago
2008
IEEE
Designing thermal management policies for today's power-dense server clusters is currently a challenge, since it is difficult to predict the exact temperature and performance...
HPCA
2001
IEEE
14 years 5 months ago
2001
IEEE
With the increasing clock rate and transistor count of today's microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and po...
ICCAD
2009
IEEE
13 years 2 months ago
2009
IEEE
Multi-core processors have become an integral part of mainstream high performance computer systems. In parallel, exponentially increasing power density and packaging costs have ne...
DAC
2006
ACM
14 years 5 months ago
2006
ACM
With ever-increasing power density and cooling costs in modern high-performance systems, dynamic thermal management (DTM) has emerged as an effective technique for guaranteeing th...