Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cooling costs for generalpurpose processors. However, when invoked, these technique...
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...
Jun Yang 0002, Xiuyi Zhou, Marek Chrobak, Youtao Z...
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new model of a thermally-managed system, where a stoch...