Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
Three-Dimensional integration provides a simultaneous improvement in wire-related delay and power consumption of microprocessor circuits. Prior work has looked at the performance,...
Power dissipation is becoming the most challenging design constraint in nanometer technologies. Among various design implementation schemes, standard cell ASICs offer the best pow...
Ruchir Puri, Leon Stok, John M. Cohn, David S. Kun...