30 search results - page 3 / 6 » Fast thermal simulation for architecture level dynamic therm... |
DAC
2006
ACM
13 years 7 months ago
2006
ACM
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
COMSWARE
2007
IEEE
13 years 11 months ago
2007
IEEE
Abstract— Minimizing the energy cost and improving thermal performance of power-limited datacenters, deploying large computing clusters, are the key issues towards optimizing the...
ISCA
2006
IEEE
13 years 5 months ago
2006
IEEE
Power density continues to increase exponentially with each new technology generation, posing a major challenge for thermal management in modern processors. Much past work has exa...
ISPASS
2005
IEEE
13 years 10 months ago
2005
IEEE
We have previously presented Qsilver, a flexible simulation system for graphics architectures. In this paper we describe our extensions to this system, which we use— instrument...
ICCD
2005
IEEE
14 years 2 months ago
2005
IEEE
FPGA logic densities continue to increase at a tremendous rate. This has had the undesired consequence of increased power density, which manifests itself as higher ondie temperatu...