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» Feature Extraction for Electronic Equipment Manufacturing
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IPCV
2007
13 years 6 months ago
Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights
- The shrunk dimension of electronic devices leads to more stringent requirement on process control and quality assurance of their fabrication. For instance, direct die-to-die bond...
Mei Dong, Ronald Chung, Edmund Y. Lam, Kenneth S. ...
FAST
2003
13 years 6 months ago
Modeling Hard-Disk Power Consumption
Excessive power consumption is a major barrier to the market acceptance of hard disks in mobile electronic devices. Studying and reducing power consumption, however, often involve...
John Zedlewski, Sumeet Sobti, Nitin Garg, Fengzhou...
RTAS
2005
IEEE
13 years 10 months ago
Out-of-Norm Assertions
Abstract— The increasing use of electronics in transport systems, such as the automotive and avionic domain, has lead to dramatic improvements with respect to functionality, safe...
Philipp Peti, Roman Obermaisser, Hermann Kopetz
EURODAC
1994
IEEE
211views VHDL» more  EURODAC 1994»
13 years 8 months ago
Advanced simulation and modeling techniques for hardware quality verification of digital systems
synchronisation also play a fundamental role in overall system robustness. ElectroMagnetic Compatibility (EMC) and ElectroMagnetic Interference (EMI) issues also have to be conside...
S. Forno, Stephen Rochel