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TCAD
2008
114views more  TCAD 2008»
13 years 4 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
CG
2010
Springer
13 years 3 months ago
The effect of task on classification accuracy: Using gesture recognition techniques in free-sketch recognition
Generating, grouping, and labeling free-sketch data is a difficult and time-consuming task for both user study participants and researchers. To simplify this process for both part...
M. Field, S. Gordon, Eric Jeffrey Peterson, R. Rob...
MOBISYS
2010
ACM
13 years 7 months ago
Augmenting mobile 3G using WiFi
We investigate if WiFi access can be used to augment 3G capacity in mobile environments. We first conduct a detailed study of 3G and WiFi access from moving vehicles, in three dif...
Aruna Balasubramanian, Ratul Mahajan, Arun Venkata...