2 search results - page 1 / 1 » Fine-grain thermal profiling and sensor insertion for FPGAs |
ISCAS
2006
IEEE
13 years 11 months ago
2006
IEEE
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
FPL
1997
Springer
13 years 9 months ago
1997
Springer
In this paper, a temperature-to-frequency transducer suitable for thermal monitoring on FPGAs is presented. The dependence between delay and temperature is used to produce a freque...