10 search results - page 2 / 2 » From ASIC to ASIP: The Next Design Discontinuity |
ICCD
2005
IEEE
14 years 3 months ago
2005
IEEE
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
ICRA
2005
IEEE
13 years 11 months ago
2005
IEEE
— A fast online gait planning method is proposed. Based on an approximate dynamical biped model whose mass is concentrated to COG, general solution of the equation of motion is a...
CODES
2007
IEEE
14 years 12 days ago
2007
IEEE
Multiple wireless technologies are converging to run on personal handhelds. The plethora of communication standards next to the cost issues of deeper submicron processing require ...
ISLPED
2009
ACM
14 years 18 days ago
2009
ACM
While researchers have invested substantial effort to build architectural power models, validating such models has proven difficult at best. In this paper, we examine the accurac...
DAC
1999
ACM
13 years 10 months ago
1999
ACM
ion model or flexible PCB solutions cannot offer a valid solution for the next millinium SoCs . James G. Dougherty, Integrated Systems Silicon LTD, Belfast, Northern Ireland ISS an...