With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
The IEEE 802.16/WiMAX standards has fully embraced multi-antenna technology and can, thus, deliver robust performance and high transmission rates. Nevertheless, due to its inheren...
Tairan Wang, Zhifeng Tao, Andreas F. Molisch, Phil...
LVDS is the acronym for Low-Voltage-DifferentialSignaling and is described in both the ANSI/TIA/EIA644 and IEEE 1596.3 standards. High performance yet Low Power and EMI have made ...
Modeling communications in wireless networks is a challenging task since it asks for a simple mathematical object on which efficient algorithms can be designed, but that must also...