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ICCAD
2010
IEEE
146views Hardware» more  ICCAD 2010»
13 years 3 months ago
Through-silicon-via management during 3D physical design: When to add and how many?
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
PE
2006
Springer
111views Optimization» more  PE 2006»
13 years 5 months ago
How many servers are best in a dual-priority M/PH/k system?
We ask the question, "for minimizing mean response time (sojourn time), which is preferable: one fast server of speed 1, or k slow servers each of speed 1/k?" Our settin...
Adam Wierman, Takayuki Osogami, Mor Harchol-Balter...
CIVR
2007
Springer
158views Image Analysis» more  CIVR 2007»
13 years 9 months ago
How many high-level concepts will fill the semantic gap in news video retrieval?
A number of researchers have been building high-level semantic concept detectors such as outdoors, face, building, etc., to help with semantic video retrieval. Using the TRECVID v...
Alexander G. Hauptmann, Rong Yan, Wei-Hao Lin
HICSS
2006
IEEE
98views Biometrics» more  HICSS 2006»
13 years 12 months ago
Electricity Markets: How Many, Where and When?
Most markets compromise the economist’s ideal of matching the marginal benefits to consumers with the marginal cost of supply for incremental purchases because individual buyers...
Nodir Adilov, Richard E. Schuler
FDL
2007
IEEE
14 years 3 days ago
How Different are Esterel and SystemC?
In this paper, we compare the underlying models of computation of the system description languages SystemC and Esterel. Although these languages have a rather different origin, we...
Jens Brandt, Klaus Schneider