In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
We ask the question, "for minimizing mean response time (sojourn time), which is preferable: one fast server of speed 1, or k slow servers each of speed 1/k?" Our settin...
Adam Wierman, Takayuki Osogami, Mor Harchol-Balter...
A number of researchers have been building high-level semantic concept detectors such as outdoors, face, building, etc., to help with semantic video retrieval. Using the TRECVID v...
Most markets compromise the economist’s ideal of matching the marginal benefits to consumers with the marginal cost of supply for incremental purchases because individual buyers...
In this paper, we compare the underlying models of computation of the system description languages SystemC and Esterel. Although these languages have a rather different origin, we...