20 search results - page 4 / 4 » Impact of Modern Process Technologies on the Electrical Para... |
ISQED
2011
IEEE
12 years 9 months ago
2011
IEEE
As process technology continues to shrink, interconnect current densities continue to increase, making it ever more difficult to meet chip reliability targets. For microprocessors...
ICCD
1994
IEEE
13 years 9 months ago
1994
IEEE
This paper presents a simple and robust method of designing the lossy-transmission-line interconnects in a network for multichip modules. This method uses wire-sizing entirely to ...
DAC
2004
ACM
14 years 6 months ago
2004
ACM
Current technology trends have led to the growing impact of both inter-die and intra-die process variations on circuit performance. While it is imperative to model parameter varia...
PDP
2005
IEEE
13 years 11 months ago
2005
IEEE
Clusters of SMPs are becoming increasingly common. However, the shared memory design of SMPs and the consequential contention between system processors for access to main memory c...
INTEGRATION
2008
13 years 5 months ago
2008
Thermal gradients across the die are becoming increasingly prominent as we scale further down into the sub-nanometer regime. While temperature was never a primary concern, its non...