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TCAD
2008
114views more  TCAD 2008»
13 years 5 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
CASES
2001
ACM
13 years 9 months ago
Storage allocation for embedded processors
In an embedded system, it is common to have several memory areas with different properties, such as access time and size. An access to a specific memory area is usually restricted...
Jan Sjödin, Carl von Platen
POPL
2008
ACM
14 years 6 months ago
Engineering formal metatheory
Machine-checked proofs of properties of programming languages have become a critical need, both for increased confidence in large and complex designs and as a foundation for techn...
Arthur Charguéraud, Benjamin C. Pierce, Bri...
SIGCOMM
2005
ACM
13 years 11 months ago
Idle sense: an optimal access method for high throughput and fairness in rate diverse wireless LANs
We consider wireless LANs such as IEEE 802.11 operating in the unlicensed radio spectrum. While their nominal bit rates have increased considerably, the MAC layer remains practica...
Martin Heusse, Franck Rousseau, Romaric Guillier, ...
IWCMC
2009
ACM
14 years 8 days ago
Effect of feedback prediction on OFDMA system throughput
In wireless communication systems, adaptive modulation and coding (AMC) is used to improve the downlink (DL) spectral efficiency by exploiting the underlying channel condition. Ho...
Mohammad Abdul Awal, Lila Boukhatem