39 search results - page 2 / 8 » Improving yield and reliability of chip multiprocessors |
HIPEAC
2010
Springer
14 years 2 months ago
2010
Springer
As CMOS feature sizes venture deep into the nanometer regime, wearout mechanisms including negative-bias temperature instability and timedependent dielectric breakdown can severely...
EDCC
2008
Springer
13 years 6 months ago
2008
Springer
The ongoing technological advances in the semiconductor industry make Multi-Processor System-on-a-Chips (MPSoCs) more attractive, because uniprocessor solutions do not scale satis...
ASPDAC
2008
ACM
13 years 7 months ago
2008
ACM
In modern circuit design, it is difficult to provide reliable parametric yield prediction since the real distribution of process data is hard to measure. Most existing approaches ...
ISQED
2009
IEEE
13 years 11 months ago
2009
IEEE
—As device feature size continues to shrink, reliability becomes a severe issue due to process variation, particle-induced transient errors, and transistor wear-out/stress such a...
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
Although silicon optical technology is still in its formative stages, and the more near-term application is chip-to-chip communication, rapid advances have been made in the develo...