3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
With the growing complexity in consumer embedded products, new tendencies forecast heterogeneous Multi-Processor SystemsOn-Chip (MPSoCs) consisting of complex integrated component...
David Atienza, Federico Angiolini, Srinivasan Mura...
The increasing levels of system integration in Multi-Processor System-on-Chips (MPSoCs) emphasize the need for new design flows for efficient mapping of multi-task applications o...
This paper presents an integrated process model of use-case driven analysis and task analysis for developing interactive systems. In the process model, an analysis model is develo...
Round-Robin scheduling is the most popular time triggered scheduling policy, and has been widely used in communication networks for the last decades. It is an efficient schedulin...
Razvan Racu, Li Li, Rafik Henia, Arne Hamann, Rolf...