6 search results - page 1 / 2 » Interconnect thermal modeling for determining design limits ... |
ISPD
1999
ACM
13 years 9 months ago
1999
ACM
ISLPED
2009
ACM
13 years 11 months ago
2009
ACM
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
ICCAD
2001
IEEE
14 years 1 months ago
2001
IEEE
In deep submicron VLSI circuits, interconnect reliability due to electromigration and thermal effects is fast becoming a serious design issue particularly for long signal lines. T...
VLSID
2009
IEEE
14 years 5 months ago
2009
IEEE
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
VLSID
2000
IEEE
13 years 9 months ago
2000
IEEE
The test signal method can be used to measure and model inductance parameters (self and mutual) of a very small interconnect especially in highdensity IC’s by using a test signa...