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    IJCV
    2012
    232views Computer Networks» more  IJCV 2012»
    Leveraging 3D City Models for Rotation Invariant Place-of-Interest Recognition
    11 years 8 months ago
    Leveraging 3D City Models for Rotation Invariant Place-of-Interest Recognition
    Download  www.stanford.edu
    Georges Baatz, Kevin Köser, David M. Chen, Ra...
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    CVPR
    2012
    IEEE
    265views Computer Vision» more  CVPR 2012»
    Example-based 3D object reconstruction from line drawings
    11 years 8 months ago
    Example-based 3D object reconstruction from line drawings
    Download  personal.ie.cuhk.edu.hk
    Recovering 3D geometry from a single 2D line drawing is an important and challenging problem in computer vision. It has wide applications in interactive 3D modeling from images, c...
    Tianfan Xue, Jianzhuang Liu, Xiaoou Tang
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    DAC
    2012
    ACM
    205views Computer Architecture» more  DAC 2012»
    Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
    11 years 8 months ago
    Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs
    Download  www.gtcad.gatech.edu
    Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
    Xin Zhao, Michael Scheuermann, Sung Kyu Lim
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    BIRTHDAY
    2012
    Springer
    268views Applied Computing» more  BIRTHDAY 2012»
    A Qualitative Security Analysis of a New Class of 3-D Integrated Crypto Co-processors
    12 years 1 months ago
    A Qualitative Security Analysis of a New Class of 3-D Integrated Crypto Co-processors
    Download  www.cs.ucsb.edu
    3-D integration presents many new opportunities for architects and embedded systems designers. However, 3-D integration has not yet been explored by the cryptographic hardware com...
    Jonathan Valamehr, Ted Huffmire, Cynthia E. Irvine...
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    ASPDAC
    2012
    ACM
    238views Hardware» more  ASPDAC 2012»
    Design for manufacturability and reliability for TSV-based 3D ICs
    12 years 1 months ago
    Design for manufacturability and reliability for TSV-based 3D ICs
    Download  www.gtcad.gatech.edu
    —The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
    David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
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