33 search results - page 3 / 7 » Leveraging 3D Technology for Improved Reliability |
DAC
2006
ACM
14 years 6 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
DATE
2009
IEEE
14 years 8 days ago
2009
IEEE
—Interconnect structures significantly contribute to the delay, power consumption, and silicon area of modern reconfigurable architectures. The demand for higher clock frequencie...
ICMCS
2010
IEEE
13 years 6 months ago
2010
IEEE
To improve upon the initial disparity estimates stemming from a local correspondence method, a subsequent refinement step is commonly employed. The performance of the stereo match...
SIGSOFT
2003
ACM
14 years 6 months ago
2003
ACM
Software products are often released with missing functionality, errors, or incompatibilities that may result in failures, inferior performances, or user dissatisfaction. In previ...
MOBISYS
2009
ACM
14 years 6 months ago
2009
ACM
Mobility footprint refers to the size, weight, and energy demand of the hardware that must be carried by a mobile user to be effective at any time and place. The ideal of a zero m...