—Chemical–mechanical polishing (CMP) is an enabling technique used in deep-submicrometer VLSI manufacturing to achieve long range oxide planarization. Post-CMP oxide topography...
In this paper, we present the parallelization of tabu search on a network of workstations using PVM. Two parallelization strategies are integrated: functional decomposition strate...
Ahmad A. Al-Yamani, Sadiq M. Sait, Habib Youssef, ...
Abstract. VLSI chips design is becoming increasingly complex and calling for more and more automation. Many chip design problems can be formulated naturally as constraint problems ...
Bella Dubrov, Haggai Eran, Ari Freund, Edward F. M...
After the discussion on the difference between floorplanning and packing in VLSI placement design, this paper adapts the floorplanner that is based on the Q-sequence to a packin...
Based on the insertion of internal and external redundant wires into L-type and U-type wires, an efficient two-phase reliability-driven insertion algorithm is proposed to insert r...