26 search results - page 2 / 6 » MCM placement using a realistic thermal model |
GLVLSI
2008
IEEE
13 years 6 months ago
2008
IEEE
The main contribution of this work is an analytical model for finding the upper bound on the temperature difference among various locations on the die. The proposed model can be u...
IC3
2009
13 years 3 months ago
2009
One proposed technique to reduce energy consumption of data centers is thermal-aware job scheduling, i.e. job scheduling that relies on predictive thermal models to select among po...
JCP
2008
13 years 5 months ago
2008
Rapid increase in transistor density and operating frequency has led to the increase in power densities, exhibiting itself as a high temperature profile. The high temperature spots...
ASPDAC
2006
ACM
13 years 9 months ago
2006
ACM
Thermal effects are becoming increasingly important during integrated circuit design. Thermal characteristics influence reliability, power consumption, cooling costs, and performan...
HPCA
2005
IEEE
13 years 11 months ago
2005
IEEE
With technology scaling, power dissipation and localized heating in global and semi-global bus wires are becoming increasingly important, and this necessitates the development of ...