20 search results - page 2 / 4 » Microarchitectural floorplanning under performance and therm... |
CODES
2007
IEEE
13 years 11 months ago
2007
IEEE
Performance analysis of microprocessors is a critical step in defining the microarchitecture, prior to register-transfer-level (RTL) design. In complex chip multiprocessor systems...
MICRO
2006
IEEE
13 years 11 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ICCD
2007
IEEE
14 years 2 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
TPDS
2008
13 years 5 months ago
2008
Multicore architectures have been ruling the recent microprocessor design trend. This is due to different reasons: better performance, thread-level parallelism bounds in modern app...
ICCAD
2008
IEEE
14 years 2 months ago
2008
IEEE
Abstract— Power consumption has become a crucial problem in modern circuit design. Multiple Supply Voltage (MSV) design is introduced to provide higher flexibility in controllin...