Inductive cross-talk within IC packaging is becoming a significant bottleneck in high-speed inter-chip communication. The parasitic inductance within IC packaging causes bounce o...
The test signal method can be used to measure and model inductance parameters (self and mutual) of a very small interconnect especially in highdensity IC’s by using a test signa...
Background: Signal transduction pathways are usually modelled using classical quantitative methods, which are based on ordinary differential equations (ODEs). However, some diffic...
Kinetic models for biochemical systems often comprise a large amount of coupled differential equations with species concentrations varying on different time scales. In this paper w...