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    TCAD
    2008
    114views more  TCAD 2008»
    Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
    13 years 5 months ago
    Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
    Download  robertdick.org
    Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
    Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
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