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TPDS
1998
13 years 5 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
CN
2008
13 years 5 months ago
2008
This paper addresses the problem of fair allocation of bandwidth resources on lossy channels in hybrid heterogeneous networks. It discusses more particularly the ability of window...