In this paper, we propose a new architecture-level parameterized transient thermal behavioral modeling algorithm for emerging thermal related design and optimization problems for ...
Duo Li, Sheldon X.-D. Tan, Eduardo H. Pacheco, Mur...
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
Wei Huang, Kevin Skadron, Sudhanva Gurumurthi, Rob...