33 search results - page 1 / 7 » Performance-aware thermal management via task scheduling |
TACO
2010
13 years 3 months ago
2010
ICPP
2008
IEEE
13 years 11 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
ISPASS
2008
IEEE
13 years 11 months ago
2008
IEEE
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...
RTAS
2009
IEEE
13 years 11 months ago
2009
IEEE
Thermal management becomes a prominent issue in system design for both server systems and embedded systems. A system could fail if the peak temperature exceeds its thermal constra...
ASPDAC
2009
ACM
13 years 11 months ago
2009
ACM
— Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC designers. In this work, we model the thermal behavior of a MPSoC as a control theory pro...