1033 search results - page 1 / 207 » Power, Performance, and Thermal Management for High-Performa... |
HPCA
2001
IEEE
14 years 5 months ago
2001
IEEE
With the increasing clock rate and transistor count of today's microprocessors, power dissipation is becoming a critical component of system design complexity. Thermal and po...
IPPS
2007
IEEE
13 years 11 months ago
2007
IEEE
In future high-performance systems it will be essential to balance often-conflicting objectives of performance, power, energy, and temperature under variable workload and environ...
TCAD
2008
13 years 4 months ago
2008
Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
IPPS
2005
IEEE
13 years 10 months ago
2005
IEEE
As energy consumption in high-performance systems has increased, thermal management has become a big challenge. Providing a cost-effective and detailed temperature sensing mechani...
DAC
2010
ACM
13 years 5 months ago
2010
ACM
Many DTM schemes rely heavily on the accurate knowledge of the chip's dynamic thermal state to make optimal performance/ temperature trade-off decisions. This information is ...