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» Power optimal MTCMOS repeater insertion for global buses
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HPCA
2005
IEEE
13 years 10 months ago
Accurate Energy Dissipation and Thermal Modeling for Nanometer-Scale Buses
With technology scaling, power dissipation and localized heating in global and semi-global bus wires are becoming increasingly important, and this necessitates the development of ...
Krishnan Sundaresan, Nihar R. Mahapatra
ASPDAC
2009
ACM
145views Hardware» more  ASPDAC 2009»
13 years 11 months ago
High performance on-chip differential signaling using passive compensation for global communication
— To address the performance limitation brought by the scaling issues of on-chip global wires, a new configuration for global wiring using on-chip lossy transmission lines is pr...
Ling Zhang, Yulei Zhang, Akira Tsuchiya, Masanori ...
ICCD
2008
IEEE
175views Hardware» more  ICCD 2008»
14 years 1 months ago
On-chip high performance signaling using passive compensation
— To address the performance limitation brought by the scaling issues of on-chip global wires, a new configuration for global wiring using on-chip lossy transmission lines(T-lin...
Yulei Zhang, Ling Zhang, Akira Tsuchiya, Masanori ...