Sciweavers

7 search results - page 2 / 2
» Power reduction of CMP communication networks via RF-interco...
Sort
View
HPCA
2009
IEEE
14 years 6 months ago
A low-radix and low-diameter 3D interconnection network design
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...
3DIC
2009
IEEE
263views Hardware» more  3DIC 2009»
13 years 9 months ago
3D optical networks-on-chip (NoC) for multiprocessor systems-on-chip (MPSoC)
Abstract— Networks-on-chip (NoC) is emerging as a key onchip communication architecture for multiprocessor systemson-chip (MPSoC). In traditional electronic NoCs, high bandwidth ...
Yaoyao Ye, Lian Duan, Jiang Xu, Jin Ouyang, Mo Kwa...