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MJ
2011
288views Multimedia» more  MJ 2011»
13 years 10 hour ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
CODES
2007
IEEE
13 years 11 months ago
ESL design and HW/SW co-verification of high-end software defined radio platforms
Multiple wireless technologies are converging to run on personal handhelds. The plethora of communication standards next to the cost issues of deeper submicron processing require ...
A. C. H. Ng, J. W. Weijers, Miguel Glassee, Thomas...