Abstract--Thermal issues are fast becoming major design constraints in high-performance systems. Temperature variations adversely affect system reliability and prompt worst-case de...
Amit Kumar 0002, Li Shang, Li-Shiuan Peh, Niraj K....
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...
Mohamed M. Sabry, Ayse Kivilcim Coskun, David Atie...
Real-time systems have reached a level of complexity beyond the scaling capability of the low-level or restricted languages traditionally used for real-time programming. While Met...
David F. Bacon, Perry Cheng, David Grove, Michael ...