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    MJ
    2011
    288views Multimedia» more  MJ 2011»
    Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
    13 years 8 days ago
    Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
    Download  infoscience.epfl.ch
    New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
    Pablo Garcia Del Valle, David Atienza
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