5 search results - page 1 / 1 » Shaping interconnect for uniform current density |
ICCAD
2002
IEEE
14 years 2 months ago
2002
IEEE
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
TCAD
2002
13 years 5 months ago
2002
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
ISVC
2009
Springer
13 years 12 months ago
2009
Springer
Abstract. In this paper we propose a new approach for tracking multiple objects in image sequences. The proposed approach differs from existing ones in important aspects of the re...
ICCAD
1997
IEEE
13 years 9 months ago
1997
IEEE
† This paper describes a novel methodology to automate the design of the interconnect distribution for multistage clock circuits. We introduce two key ideas. First, a hierarchica...
DAC
2004
ACM
14 years 6 months ago
2004
ACM
The negative effect of electromigration on signal and power line lifetime and functional reliability is an increasingly important problem for the physical design of integrated cir...