500+ MHz designs using deep-submicron (DSM) copper interconnects require accurate and efficient modeling of cladding-metals’ frequency-dependent impedance [1]. In this paper, fo...
Single-walled carbon nanotube (SWCNT) bundles have the potential to provide an attractive solution for the resistivity and electromigration problems faced by traditional copper int...
The improved T and improved n models are proposed for onchip interconnect macromodeling. Using global approximations, simple approximation frames are derived and applied to modeli...